布鲁克’s automated AFMs provide proven industrial metrology solutions for surface roughness measurement, chemical mechanical planarization (CMP), and etch-depth measurements on the most current technology nodes and wafers.
原子力量分析是最准确,无损的方法可用于优化和监视具有挑战性的CMP和蚀刻过程步骤。直接测量不需要测试结构或模型,并且可以在DIE的活跃区域中呈现为过程变化的最佳敏感性。
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布鲁克partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.