nm-VI
5nm Production Photomask Repair
Punti Salienti
Precision Repair of Advanced, Critical-Level Photomasks
Bruker’s AFM nanomachining systems are the global standard and preferred production technique for precision repair of advanced, critical-level photomasks. The nm-VI®system is Bruker’s sixth generation AFM-Guided Nanomachine. The nm-VI sets Bruker apart as the company that can develop and deliver the innovative nano-scale material shaping processes required to keep the semiconductor industry in concert with the 5 nanometer technology node and beyond.
Caratteristiche
Industry Leading Mask Repair Method
Nanomachining is a unique defect repair technique in the semiconductor industry, combining the positional control of an AFM and proprietary Nanomachining hardware and software to perform material removal at nanometer levels.
Its appeal lies in the precise and accurate removal of defects of various materials including chrome, MoSi, opaque MoSi, silicon nitride, quartz, EUV, foreign materials, and unknown particles. Its iterative repair capability and planar material removal guarantees repaired areas with a much wider “Through Focus” transmission window.
Addressing Industry's Critical Challenges
With six generations and nearly 20 years of inline experience, Bruker's AFM-guided nanomachine boasts unique optimizations and enhancements to control pattern defects in the production of high-end photomasks with decreasing feature size and increasing mask complexity. Notable features include:
- Standard BitClean® Function – Special hardware and software automation that provides final pre-pellicle local clean capability using the nanomachining tip for the removal of persistent unknown particle contamination.
- Integrated local pattern copy functions come standard with the system.
- 设计图像检索软件包（可选）包括计算机硬件和NM-VI系统接口软件。它提供了从原始设计文件中检索蒙版维修区域图像图像的片段的能力，可为AFM扫描图像正确，显示和覆盖在指定的维修区域，以进行操作员的维修。
A Technique with Minimal Trade-Offs
The nm-VI offers production proven nanomachining with few downsides. The AFM-based nanomachining technique boasts the following over other (focused ion beam (FIB) and laser or electron beam) mask repair systems.
- no vacuum requirement
- no chemistries
- no chemical residues
- 没有光束相关的充电效果
- no need for constant drift correction by re-registration to undesirable positioning markers
Supporto
Support
How Can We Help?
Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
我们训练有素的支持工程师，应用程序科学家和主题专家团队全力致力于通过系统服务和升级以及应用程序支持和培训来最大化您的生产率。betway手机客户端下载