JVSENSUS-600F
X-ray diffraction imaging (XRDI) inspection system
命运
JVSENSUS-600F
The JVSensus-600F is the X-ray defect metrology system for 300mm Si device manufacturers. It helps identify problems encountered during wafer production using the latest X-ray diffraction imaging (XRDI) technology. Applications include monitoring edge damage to prevent costly wafer breakage during ultra fast anneal. It can qualify and monitor process tools at any technology node, which reduces cycle times and facilitates fab expansion.
Características
轻松识别结晶缺陷
JVSensus enables its users to identify cracks and other defects in the wafer which can cause catastrophic structural failure, BEFORE the breakage occurs. Once a defect has been observed, non-destructive cross section review images can be performed to locate the defect locations within the wafer depth.
测量图案晶圆
Measurements can be performed on blanket, patterned, and metalized wafers without sample preparation. The defects can be identified even when a pattern is present on the wafer.
检测滑动
The major cause of overlay issues is slip. Whether it's a logic patterned wafer, GaN on Si or ingot slides, JVSensus can detect slip in minutes.
apoio
Support
我们能帮你什么吗？
布鲁克partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
我们训练有素的支持工程师，应用程序科学家和主题专家团队全力致力于通过系统服务和升级以及应用程序支持和培训来最大化您的生产率。betway手机客户端下载