ContourSP
强调
ContourSP
我ncorporating over ten years of packaging optical characterization expertise, the ContourSP Large Panel Metrology System more than doubles the measurement throughput of high-density interconnect PCB (HDI-PCB) substrates over previous-generation WLI instruments. The system is specifically designed to measure each layer of the PCB panels during manufacturing, and incorporates a host of advanced features that deliver utmost production performance, convenience, reliability, and throughput for the semiconductor packaging industry. The gauge-capable ContourSP utilizes an intuitive production interface that offers fast and easy fiducial alignment with configurable user input.
特征
Unmatched Accuracy
凭借其新的耐振动系统设计和专利的Wyko垂直扫描干涉法（VSI）成像，具有仪表能力的ContourSP系统在纳米分辨率中执行了极为准确的3D临界尺寸（CD）测量值。这种能力与广泛的自动化相结合，可以使轮廓既可以作为功能强大的表面纹理计量仪器，也可以作为易于使用的缺陷检查工具。
Streamlined Operation and Analysis
The ContourSP intuitive production interface offers fast and easy fiducial alignment with configurable user input. In addition to pass/fail information, users can now select detailed parameter results for display on the summary screen. Vision64 software provides full access control for engineers, technicians and operators with easy coordinate file import capability, guaranteeing system-to-system recipe portability and fast file creation.
Large Measurable Area Tailored to Panel Metrology
The system utilizes Bruker's revolutionary gantry-based design and integrated workstation to support up to 600x600 millimeter samples in a highly compact footprint. Software designed specifically for production panel metrology helps manufacturing engineers and operators to take the fullest advantage of the unique optical profiling features with dynamic signal segmentation, remeasure functionality, topography scanning to compensate for wafer bow, coordinate file import, ESD, panel ID reading, and pattern recognition.
