ContourSP
命运
ContourSP
Incorporating over ten years of packaging optical characterization expertise, the ContourSP Large Panel Metrology System more than doubles the measurement throughput of high-density interconnect PCB (HDI-PCB) substrates over previous-generation WLI instruments. The system is specifically designed to measure each layer of the PCB panels during manufacturing, and incorporates a host of advanced features that deliver utmost production performance, convenience, reliability, and throughput for the semiconductor packaging industry. The gauge-capable ContourSP utilizes an intuitive production interface that offers fast and easy fiducial alignment with configurable user input.
características
Unmatched Accuracy
凭借其新的耐振动系统设计和专利的Wyko垂直扫描干涉法（VSI）成像，具有仪表能力的ContourSP系统在纳米分辨率中执行了极为准确的3D临界尺寸（CD）测量值。这种能力与广泛的自动化相结合，可以使轮廓既可以作为功能强大的表面纹理计量仪器，也可以作为易于使用的缺陷检查工具。
流线型操作和分析
The ContourSP intuitive production interface offers fast and easy fiducial alignment with configurable user input. In addition to pass/fail information, users can now select detailed parameter results for display on the summary screen. Vision64 software provides full access control for engineers, technicians and operators with easy coordinate file import capability, guaranteeing system-to-system recipe portability and fast file creation.
Large Measurable Area Tailored to Panel Metrology
该系统利用Bruker的革命性龙门设计和集成工作站来支持高度紧凑的足迹中多达600x600毫米的样品。专门为生产面板计量学设计的软件可帮助制造工程师和操作员充分利用具有动态信号细分，减排功能，地形扫描以补偿晶圆弓，坐标文件导入，ESD，面板ID读数和面板ID读数和坐标，以充分利用独特的光学分析功能。模式识别。
