X200
高分辨率自动在线X射线检查（XRI）系统
亮点
X200
On the leading edge of a new category of in-line transmissive inspection and metrology equipment, the X200 XRI system brings front-of-line semiconductor fab-like inspection to the backend manufacturing line. The system uses proprietary data collection architecture, industry-leading data processing, and innovative machine learning techniques to provide fully automatic, fast, 100% inspection and real-time feedback on user-defined regions of interest. Designed for continuous use on the manufacturing floor and able to inspect a range of semiconductor components—including singulated units, strips, boats, wafers, and film frames—the X200 provides the unique capabilities manufacturers need to meet increasingly stringent customer requirements and regulatory standards. The X200 XRI system is ideal for a range of semiconductor applications, from advanced packaging and system in a package (SiP) production to 2.5D and 3D integrated circuit chip (IC) integration and power component manufacturing.
特点
Unique Instrumentation for Advanced Semiconductor Defect Inspection
With advanced instrumentation and proprietary system architecture and processing techniques, X200 enables uniquely precise quantification,功能表面特征，缺陷和变化的计算，位置和解释。该系统还提供了全面的数据和记录管理。
这是通过：
- 全场2.8 µm像素尺寸。
- Collection of large field-of-view transmissive data at full resolution and with 16-bit data-rich images.
- Immediate feedback on critical attributes (solder joint quality, voids, bridges, and missing solder) for 100% of the desired regions of interest.
- Easy recipe setup with pre-configured data processing and reporting options.
- On-tool display, storage, and sharing for process trend and reject location data.
应用
Advanced Packaging
Advances in semiconductor packaging continue to enable higher performance in electronic components. With advanced packaging comes tighter tolerances, smaller interconnects, and more vertical layers. Together with increasingly stringent quality and reliability requirements from system manufacturers, these trends have exposed the limitations of existing inspection and metrology techniques.
The X200's technology was developed to quickly and precisely identify small changes in device interconnect structures and to provide real-time feedback for process control and screening.
Instead of pulling a small sample from your manufacturing line for lengthy and data-limited 3D X-ray and cross-sectioning, you can automatically monitor 100% of your production in real-time and achieve new levels of quality, reliability, and production yield.
包装中的系统
The Internet of Things is putting complex electronic systems into products we interact with every day. While conventional surface-mount area array components are routinely 100% inspected with printed circuit board assembly (PCBA) XRI, these tools lack the resolution and sensitivity to inspect the smaller feature-size conductors in SiP.
然而,力量的X200型XRI技术允许高speed 100% inspection and metrology at the micron scale. With high sensitivity and machine learning-based inspection algorithms, X200 automatically inspects SiP products to rapidly detect process variation and screen defects, such as non-wet solder joints, bridging, and voids.
2.5D/3D IC
人工智能，高速网络和其他处理密集型市场的设备已转移到2.5D和3D软件包体系结构，以实现高内存带宽和增加数据传输速率。垂直整合迫使manufacturers to use transmissive inspection techniques to monitor their processes, however, conventional point projection high-resolution X-ray lacks the speed and sensitivity to provide adequate in-line control.
X200的算法以几秒钟的秒数获取大量数据集，并在整个视野中完全分辨率。使用先进的机器学习算法，立即对数千个焊接接头进行表征和评估。详细的热图和智能离群检测可为制造过程控制和筛选有缺陷的互连。
Power Electronics
电力电子设备在电动和自动驾驶汽车中迅速增殖。这些系统对故障和有缺陷的组件尤其不宽容，但是功率组件的结构（散热器，铝线，焊接固定附件等）使传统的传播检查技术变得困难或不可能。
X200专有的高功率X射线源技术具有从电源设备收集丰富数据集的敏感性，因此为制造提供了满足最苛刻的汽车质量要求的能力。
配件
分析工具包s
The X200 Data Analysis Toolkit revolutionizes the use of transmissive inspection technology in semiconductor packaging by eliminating manual processing and interpretation of X-ray images and letting image processing-based algorithms identify defective units.
X200的专有分析工具可以实时使用机器学习技术来定位和分析感兴趣的功能，因为系统从测试中捕获样品中的数据。
Supervised model learning can be accomplished on limited sample sizes to progress more quickly to production. With the addition of supervised learning from programmed defects or offline analyses, process control and reject detection criteria can be tuned to the user’s unique application specifications.
支持
Support
我们能帮你什么吗？
布鲁克partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.