Rhazer-III
Production Photomask Haze Mitigation and Removal
强调
Rhazer III
The Bruker Rhazer-III®系统专门为晶圆晶圆厂设计，可提供投资雾化的雾霾和管理能力。Rhazer技术是干净的and干燥.
Eigenschaften
Photo-Induced Defect Management (Haze Mitigation)
Photo-induced micro-contamination on photomasks (haze) has become an increasingly pervasive and costly problem throughout the semiconductor industry. Recent wet clean and environmental control techniques have helped to slow haze formation during wafer stepper exposures, but show no promise of a haze prevention solution. The Bruker Rhazer-III®系统专门为晶圆晶圆厂设计，可提供投资雾化的雾霾和管理能力。Rhazer技术是干净的and dry. Processing the mask does not require removal of the pellicle and causes no damage to the mask absorber materials and no changes to phase, transmission or CDs, meaning reticles can be cleaned as often as needed without leaving the control of the fab line.
关键性能特征
提高光刻线的效率：
- 干燥过程 - 无颗粒去除
- Fast turnaround - full reticle clean
- 完全控制 - 雷克斯永远不会离开晶圆厂
- Fewer cleans - no haze formation in storage
全自动操作：
- SMIF和高架轨道兼容；RFID/OCR/条形码读取器
- SEC/GEM兼容
- Robotic handling including mask flipper
- Easy to operate; highly user friendly GUI
扩展口罩寿命：
- No absorber damage
- 没有CD，相或传输方差
- 没有添加的化学残留物
- No limit to number of cleans
Wafer Fab Cost Savings:
- 少浪费扫描仪停机等待面具
- Very low cost mask cleans
- 需要更少的重复口罩
- Extended interval between defect inspections
- 减少了与雾相关的晶圆损失
“绿色”技术：
- 没有酸，溶剂或去离子水
- 没有有害的废水或废物管理
- Low energy consumption (7kW @ 208V AC)
- Small system footprint (1.24m x 2.31m)
Results
支持
支持
How Can We Help?
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