Photomask Repair

Rhazer-III

第三代雾霾去除系统

Production Photomask Haze Mitigation and Removal

najważniejszeInformacje

Rhazer III

The Bruker Rhazer-III®system is specially designed for the wafer fab to provide an in-fab haze removal and management capability. Rhazer technology is清洁anddry.

博士y, Laser-Based
透明过程以分解结晶生长
Utilizes indirect thermal decomposition and covers the entire mask area under the pellicle.
Independent
of particle size
Decomposition is not dependent on absorption cross section of the defect. Delivering complete removal of seed nucleation sites in the processed areas.
No Degradation
of material
对临界维度,相位或传输没有变化。对敏感图案的几何形状没有损害(SRAF,光学辅助功能等)。
例行删除
crystalline defects
The Rhazer process typically removes ammonium sulfate, ammonium carbonate, and ammonium oxalate defects.

Cechy Charakterystyczne

特征

Photo-Induced Defect Management (Haze Mitigation)

Photo-induced micro-contamination on photomasks (haze) has become an increasingly pervasive and costly problem throughout the semiconductor industry. Recent wet clean and environmental control techniques have helped to slow haze formation during wafer stepper exposures, but show no promise of a haze prevention solution. The Bruker Rhazer-III®system is specially designed for the wafer fab to provide an in-fab haze removal and management capability. Rhazer technology is clean and dry. Processing the mask does not require removal of the pellicle and causes no damage to the mask absorber materials and no changes to phase, transmission or CDs, meaning reticles can be cleaned as often as needed without leaving the control of the fab line.

关键性能特征

提高光刻线的效率:

  • 干燥过程 - 无颗粒去除
  • Fast turnaround - full reticle clean
  • Full control - retcles never leave the wafer fab
  • Fewer cleans - no haze formation in storage

Fully Automated Operation:

  • SMIF和高架轨道兼容;RFID/OCR/条形码读取器
  • SEC/GEM兼容
  • Robotic handling including mask flipper
  • Easy to operate; highly user friendly GUI

Extends Mask Lifetime:

  • No absorber damage
  • No CD, phase or transmission variance
  • No added chemical residues
  • No limit to number of cleans

Wafer Fab Cost Savings:

  • Less wasted scanner downtime waiting for masks
  • Very low cost mask cleans
  • 需要更少的重复口罩
  • Extended interval between defect inspections
  • 减少了与雾相关的晶圆损失

“绿色”技术:

  • No acids, solvents or de-ionized water
  • No harmful effluents or waste management
  • Low energy consumption (7kW @ 208V AC)
  • Small system footprint (1.24m x 2.31m)

Results

WSPARCIE

支持

How Can We Help?

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Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.

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