InSight WLI
强调
InSight WLI with 300mm Wafer Handler
" WLI系统提供unma的完全自动化的见解tched optical surface measurement capabilities with wafer-handler integration. Designed from the ground up for the most demanding R&D, quality assurance, and process quality control needs, the InSight WLI incorporates Bruker's patented tip/tilt head, a proprietary self-calibrating laser reference, integrated pattern recognition, and a host of other Bruker-exclusive interferometry innovations. No other metrology system provides the non-contact accuracy, throughput, and operator convenience for such a vast range of production metrology and imaging applications.
Eigenschaften
Benchmark for Accuracy and Robustness
- Unique metrology sensor design with patented dual-LED light source
- Self-calibrating, metrology optimizing laser reference
- 集成振动 - 隔离地板安装柜
Measurements & Analysis
Fastest, Easiest Nanometer-Scale Measurements
- Fully automated measurement capabilities
- Industry leading gage on nanometer-scaled features
最强大的测量和分析
- Streamlined, customizable production interface
- 灵活的配方和自动化测量优化
- Extensive library of filters and customizable analysis options
Configurations for Demanding Requirements
要求高级包装的配置
- Complete die flatness and CMP metrology solution
- TSV and interconnect measurements
- 全鞘层的热点和缺陷检测
Factory Automation Ready
- 秒/宝石
- S2/S8合规
- FDC, DCOL available
Anwendungen
Read More About WLI Metrology In Use
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Characterization of CMP Processes with White Light Interferometry（PDF，4 MB）This application note describes the measurement and analysis advantages that white light interferometry (WLI) offers for the various CMP components. It also details an improvement study that investigated asperity behavior of the fluid layer under the wafer during the CMP process and revealed the effects of polishing and conditioning on the pads, as well as wafer polish results.
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Performing Comprehensive Wafer Inspection with Non-Contact 3D Optical Profiling（PDF，3 MB）This application note discusses how 3D optical profiling provides many advantages over other measurement techniques for non-contact inspection of semiconductor packaging front-end process research and control. These advantages range from fully automated measurements and non-destructive inspection to custom analyses and fast measurement speeds.
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Advantages of Measuring Surface Roughness with White Light Interferometry（PDF，3 MB）该申请说明讨论了使用白光干涉法（WLI）光学剖面仪的平均粗糙度测量方法的使用。解释了空间过滤器，以及ASME B46.1-2009，ISO 13565-1和JIS B 0671-1.3选择WLI选择的一些规范标准要求以及适用于WLI选择的主要技术原因ISO 25178-2的全面测量标准。
支持
支持
How Can We Help?
Bruker与我们的客户合作解决了现实世界中的应用程序问题。我们开发下一代技术，并帮助客户选择正确的系统和配件。在工具出售工具很久之后，这种合作伙伴关系继续通过培训和扩展服务。betway手机客户端下载
Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.