SIRIUS-FW
Critical Metrology
高产
Lo más destacado
Sirius-FW
The Sirius-FW is a fourth generation, fully automated µXRF metrology platform that offers specialized single-bump metrology to monitor %Ag in SnAg solder bumps and under bump metalization. Its mature technology boasts a field proven uptime greater than 95%. The Sirius-FW system is capable of measuring single solder bumps as small as 10µm diameter with sub-micron positioning accuracy. Its automated intensity correction (AIC) ensures long-term stability and drift elimination. As would be expected for a production tool, the Sirius-FW is recipe driven and supports full fab automation.
características
Key Features
- 带有垂直激发的µXRF-内联hvm计量的优化配置
- 小点（AGKα上<15 µm）
- Low sensitivity to Z-errors
- 边缘排除<0.5毫米
- 低功率密封的X射线W管的无损
- 多毛细管条件光学元件，多色激发
- SDD检测器阵列可高效光子收集
- 象限集合减少了对侧向错误的依赖，这在圆顶形焊料上的测量时尤其重要
- 支持of highly bent substrates (up to 2mm bending), glass substrates
Instrumental for High Yield
Sirius-FW应用程序对高收益有助于：
- snag焊料中的％ag - 控制颠簸的钥匙，重新温度，定期凸起形状和粘结所需
- 焊点高度，UBM的金属厚度（在凹凸金属化下），后颠簸，RDL（重新分布层）和支柱高度：CU，NI，AU，PD TI - 良好粘合所需的跨滤器平面性的关键
Beneficios
好处
- Single bump metrology for process footprint determination
- GR&R capable metrology on key applications
- Production worthy productivity and MAM (move–acquire-measure) times: seconds for metal thickness, 30-60s for %Ag and bump height
- 使用主要包装工厂，经过验证的稳定性和舰队匹配
Soporte
支持
How Can We Help?
Bruker与我们的客户合作解决了现实世界中的应用程序问题。我们开发下一代技术，并帮助客户选择正确的系统和配件。在工具出售工具很久之后，这种合作伙伴关系继续通过培训和扩展服务。betway手机客户端下载
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