Sirius-FW
关键计量学
for high yield
Основные моменты
Sirius-FW
Sirius-FW是第四代，全自动的µXRF计量平台，可提供专门的单重度计量，以监视snag焊料颠簸和凹凸金属化中的％ag。它的成熟技术拥有大于95％的现场正常运行时间。Sirius-FW系统能够测量具有亚微米定位精度的直径至10μm的单焊料凸起。其自动强度校正（AIC）可确保长期稳定性和漂移消除。正如生产工具所期望的那样，Sirius-FW是配方驱动的，并支持完整的Fab Automation。
Особенности
主要特征
- µXRF with vertical excitation - optimized configuration for inline, HVM metrology
- Small spot (<15 µm on AgKα)
- 对Z-Error的低灵敏度
- Edge exclusion <0.5 mm
- Non-destructive with low power sealed x-ray W tube
- Polycapillary conditioning optics, polychromatic excitation
- SDD detectors array for efficient photon collection
- Quadrant collection reduces dependence on lateral errors, that is especially important when measure on a dome-shaped solder bumps
- 支持高度弯曲的底物（最多2mm弯曲），玻璃基板
高产的工具
Sirius-FW applications are instrumental for high yield:
- %Ag in SnAg solder – key to control bumps reflow temperature, needed for regular bump shape and bonding
- Solder bump height, metal thickness of UBM (under bump metallization), back bumps, RDL (redistribution layers) and pillars height: Cu, Ni, Au, Pd Ti – key to cross-wafer planarity needed for good bonding
Преимущества
Benefits
- 单个凸起计量学用于过程足迹确定
- 关键应用程序的GR＆R能力计量
- 生产值得生产力和MAM（移动量量）时间：金属厚度的秒，％Ag和凹凸高30-60
- TOR on major packaging fabs, proven stability and fleet matching
подер代
Support
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布鲁克partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.