SIRIUS-FW
Critical Metrology
for high yield
하이라이트
Sirius-FW
The Sirius-FW is a fourth generation, fully automated µXRF metrology platform that offers specialized single-bump metrology to monitor %Ag in SnAg solder bumps and under bump metalization. Its mature technology boasts a field proven uptime greater than 95%. The Sirius-FW system is capable of measuring single solder bumps as small as 10µm diameter with sub-micron positioning accuracy. Its automated intensity correction (AIC) ensures long-term stability and drift elimination. As would be expected for a production tool, the Sirius-FW is recipe driven and supports full fab automation.
특징
Key Features
- 带有垂直激发的µXRF-内联hvm计量的优化配置
- 小点（AGKα上<15 µm）
- Low sensitivity to Z-errors
- 边缘排除<0.5毫米
- 低功率密封的X射线W管的无损
- Polycapillary conditioning optics, polychromatic excitation
- SDD detectors array for efficient photon collection
- 象限集合减少了对侧向错误的依赖，这在圆顶形焊料上的测量时尤其重要
- Support of highly bent substrates (up to 2mm bending), glass substrates
Instrumental for High Yield
Sirius-FW应用程序对高收益有助于：
- snag焊料中的％ag - 控制颠簸的钥匙，重新温度，定期凸起形状和粘结所需
- Solder bump height, metal thickness of UBM (under bump metallization), back bumps, RDL (redistribution layers) and pillars height: Cu, Ni, Au, Pd Ti – key to cross-wafer planarity needed for good bonding
혜택
Benefits
- Single bump metrology for process footprint determination
- GR&R capable metrology on key applications
- Production worthy productivity and MAM (move–acquire-measure) times: seconds for metal thickness, 30-60s for %Ag and bump height
- 使用主要包装工厂，经过验证的稳定性和舰队匹配
지원
Support
How Can We Help?
Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
我们训练有素的支持工程师，应用程序科学家和主题专家团队全力致力于通过系统服务和升级以及应用程序支持和培训来最大化您的生产率。betway手机客户端下载