QC-TT
X-ray diffraction imaging (XRDI) inspection system
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QC-TT
The Bruker QC-TT is a defect metrology system using the latest X-ray diffraction imaging (XRDI) technology for the most comprehensive crystallographic defect inspection solution. The QC-TT is used to analyze Si wafer and ingot quality for the presence of defects and cracks within wafer.对于零边的排除，甚至可以自动识别斜角边缘上的缺陷。由于X射线衍射的性质，并且与光学技术不同，晶圆不需要蚀刻或抛光即可看到缺陷。
Características
早期缺陷检测
A main application of the tool is by Si wafer manufacturers. Here it can be used early in the process on ingot slices before the slices are polished. This allows earlier detection of slip and other harmful defects within the ingot, and to decide where on the ingot to start slicing for good wafers.
Automatic Defect Detection
The Bruker QC-TT is also used for SiC monitoring. A key issue in the manufacturing process of SiC are the different defects that can be grown into the ingot. The QC-TT can be used to detect and classify these defects into the key types required by manufacturers: threading edge (TED), threading screw (TSD) and basal plane (BPD) defects. This detection can be done automatically as part of the measurement process.
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布鲁克partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.