QC-TT
X射线衍射成像（XRDI）检查系统
Основные моменты
QC-TT
The Bruker QC-TT is a defect metrology system using the latest X-ray diffraction imaging (XRDI) technology for the most comprehensive crystallographic defect inspection solution. The QC-TT is used to analyze Si wafer and ingot quality for the presence of defects and cracks within wafer.With zero edge exclusion, even defects on the bevel edge and the notch can be identified automatically.由于the nature of the X-ray diffraction, and unlike optical techniques, the wafer does not need to be etched or polished to be able to see the defects.
Особенности
Early Defect Detection
该工具的主要应用是Si Wafer制造商。在这里，在抛光切片之前，它可以在Ingot片上的早期使用。这允许早期检测到铸锭内的滑动和其他有害缺陷，并决定在铸锭上开始切片以开始切片。
自动缺陷检测
Bruker QC-TT也用于SIC监测。SIC制造过程中的一个关键问题是可以生长到铸锭的不同缺陷。QC-TT可用于检测和将这些缺陷分类为制造商所需的关键类型：螺纹边缘（TED），螺纹螺钉（TSD）和基础平面（BPD）缺陷。该检测可以自动作为测量过程的一部分进行。
Поддержка
支持
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Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.