QC-TT
X-ray diffraction imaging (XRDI) inspection system
高亮
QC-TT
Bruker QC-TT是使用最新的X射线衍射成像（XRDI）技术的缺陷计量系统，用于最全面的晶体学缺陷检查解决方案。QC-TT用于分析Si晶片和铸入式质量，以在晶圆内存在缺陷和裂纹。对于零边的排除，甚至可以自动识别斜角边缘上的缺陷。由于X射线衍射的性质，并且与光学技术不同，晶圆不需要蚀刻或抛光即可看到缺陷。
功能
早期缺陷检测
A main application of the tool is by Si wafer manufacturers. Here it can be used early in the process on ingot slices before the slices are polished. This allows earlier detection of slip and other harmful defects within the ingot, and to decide where on the ingot to start slicing for good wafers.
自动缺陷检测
的力量QC-TT也用于碳化硅监控。A key issue in the manufacturing process of SiC are the different defects that can be grown into the ingot. The QC-TT can be used to detect and classify these defects into the key types required by manufacturers: threading edge (TED), threading screw (TSD) and basal plane (BPD) defects. This detection can be done automatically as part of the measurement process.
支持
Support
我们能帮你什么吗？
布鲁克partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
我们训练有素的支持工程师，应用程序科学家和主题专家团队全力致力于通过系统服务和升级以及应用程序支持和培训来最大化您的生产率。betway手机客户端下载