QC-TT
X-ray diffraction imaging (XRDI) inspection system
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QC-TT
Bruker QC-TT是使用最新的X射线衍射成像（XRDI）技术的缺陷计量系统，用于最全面的晶体学缺陷检查解决方案。QC-TT用于分析Si晶片和铸入式质量，以在晶圆内存在缺陷和裂纹。With zero edge exclusion, even defects on the bevel edge and the notch can be identified automatically.由于the nature of the X-ray diffraction, and unlike optical techniques, the wafer does not need to be etched or polished to be able to see the defects.
Cechy charakterystyczne
Early Defect Detection
A main application of the tool is by Si wafer manufacturers. Here it can be used early in the process on ingot slices before the slices are polished. This allows earlier detection of slip and other harmful defects within the ingot, and to decide where on the ingot to start slicing for good wafers.
自动缺陷检测
的力量QC-TT也用于碳化硅监控。A key issue in the manufacturing process of SiC are the different defects that can be grown into the ingot. The QC-TT can be used to detect and classify these defects into the key types required by manufacturers: threading edge (TED), threading screw (TSD) and basal plane (BPD) defects. This detection can be done automatically as part of the measurement process.
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布鲁克partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
我们训练有素的支持工程师，应用程序科学家和主题专家团队全力致力于通过系统服务和升级以及应用程序支持和培训来最大化您的生产率。betway手机客户端下载